# Engineering Review Report ## A. Executive Summary ### Overall System Maturity Level The ASF Sensor Hub demonstrates a well-structured architecture with clear layering, defined responsibilities, and adherence to embedded system constraints. However, several critical gaps and risks need to be addressed before proceeding to the implementation phase. ### Major Risks (Top 5) 1. **Cross-Feature Conflicts**: Potential timing conflicts between OTA updates and DAQ operations. 2. **State Machine Completeness**: Undefined transitions for error handling and degraded states. 3. **Data Integrity Risks**: Insufficient guarantees for data persistence during power loss. 4. **Security Gaps**: Lack of detailed secure boot and cryptographic key management mechanisms. 5. **Scalability Concerns**: Limited provisions for adding new sensor types or features. ### Go / No-Go Recommendation **No-Go**: Address the identified critical risks and gaps before proceeding to the implementation phase. --- ## B. Detailed Findings ### 1. Architecture #### Findings: - **Layering & Separation of Concerns**: Proper abstraction boundaries are defined, but direct hardware access by features bypassing the System Manager is a risk. **Severity: Major** - **State Machine Validity**: Some states (e.g., ERROR, DEGRADED) lack defined transitions and behaviors. **Severity: Critical** #### Recommendations: - Enforce strict access controls to hardware and persistence layers. - Define and document all state transitions and behaviors. ### 2. Requirements #### Findings: - **Missing Requirements**: No explicit requirements for handling SD card wear or power loss scenarios. **Severity: Critical** - **Conflicting Requirements**: OTA updates may interfere with real-time DAQ operations. **Severity: Major** #### Recommendations: - Add requirements for wear leveling and power loss recovery. - Define OTA timing constraints to avoid conflicts. ### 3. Performance #### Findings: - **Memory Usage Risks**: High-frequency sampling and local filtering may exceed ESP32-S3 memory limits. **Severity: Major** #### Recommendations: - Optimize memory usage by profiling and limiting buffer sizes. ### 4. Reliability #### Findings: - **Fault Tolerance**: No defined behavior for sensor failures during runtime. **Severity: Major** #### Recommendations: - Implement fallback mechanisms for failed sensors. ### 5. Security #### Findings: - **Secure Boot**: No detailed mechanism for secure boot and firmware authenticity verification. **Severity: Critical** #### Recommendations: - Implement secure boot and cryptographic verification for firmware. ### 6. Maintainability #### Findings: - **Scalability**: Adding new sensors requires significant manual effort. **Severity: Minor** #### Recommendations: - Use a modular approach for sensor integration. --- ## C. Missing / Risky Areas ### Missing System Requirements - SD card wear leveling. - Power loss recovery mechanisms. ### Missing System States - Detailed ERROR and DEGRADED state transitions. ### Missing Failure Handling - Sensor failure fallback mechanisms. ### Missing Documentation - Secure boot and cryptographic key management. --- ## D. Improvement Recommendations 1. **Architectural Enhancements**: - Enforce strict abstraction boundaries. - Define all state transitions and behaviors. 2. **Requirement Additions**: - Add requirements for SD card wear leveling and power loss recovery. 3. **Security Improvements**: - Implement secure boot and cryptographic verification mechanisms. 4. **Scalability Enhancements**: - Adopt a modular approach for sensor integration. --- ## E. Generated Artifacts ### State Machine Diagram ```mermaid graph TD INIT --> IDLE IDLE --> RUNNING RUNNING --> DEGRADED RUNNING --> ERROR DEGRADED --> TEARDOWN ERROR --> TEARDOWN TEARDOWN --> INIT ``` ### Cross-Feature Conflict Table | Feature A | Feature B | Conflict Description | Resolution Recommendation | |-----------------|-----------------|-------------------------------|----------------------------------| | OTA | DAQ | Timing conflicts | Define OTA timing constraints | | Persistence | Power Loss | Data corruption risks | Add wear leveling and recovery | ---